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5 G – Setting world records in spectral efficiency using MIMO
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POSITION OVERVIEW Senior RF Microwave Hybrid Assembler
The NI Manufacturing team is seeking a Senior RF Microwave Hybrid Assembler, who will be responsible for multiple or all aspects of high frequency RF hybrid assembly of microcircuits. The essential functions of the role will be:
Read microcircuit dwg and specification and assemble microcircuit accordingly.
Ability to epoxy die attach components as small as 10 x 10 micro-inch with gap of 2 micro-inch, or less, consistently
Ability to perform bonding using ball bonder and/or wedge bonder manual tools.
Experience with gap welding and/or ribbon bonding is a plus
At least 5+ years of experience in epoxy or eutectic die attach of hybrid components in high frequency microcircuits (18GHz and above)
At least 5+ year of experience in wire bonding – one or both, wedge-wedge bonding or ball-wedge bonding, using manual bonder.
Ability to work under microscope with high magnification (40x to 70x) up to 80%
Experience with auto bonder and auto pick & place machines