Sr Hybrid Assembler at National instruments

Posted in Architecture 11 days ago.

This job brought to you by eQuest

Type: Full-Time
Location: Santa Clara, California





Job Description:

Why NI?

For 40 years, National Instruments has worked with engineers and scientists to provide answers to the most challenging questions. Through these pursuits, NI customers have brought hundreds of thousands of products to market, overcome innumerable technological roadblocks, and engineered a better life for us all.   Historically, National Instruments has been a top 100 employer of choice as ranked by several different sources.  If you want to work on cool stuff at a cool company, you’re in the right place!  Here’s a snippet of some of our core industry leadership.

Watch Video:  40 Years of NI Success



  • 5 G – Setting world records in spectral efficiency using MIMO


  • Internet of Things (IoT) - With NI’s technology providing unmatched capabilities in measurement, control, ruggedness, and connectivity, along with our expert ecosystem, you can realize the benefits of the Industrial Internet of Things (IIoT) today.


  • Semiconductor - NI semiconductor test customers report 10X improvement in test times while maintaining measurement and performance requirements.


  • Autonomous Automotive - As vehicles advance towards autonomous operation, test engineers face drastically increasing system complexity while dealing with ever present cost and time pressure.


  • Aerospace & Defense -  NI provides industry-leading performance and accuracy with best-in-class synchronization for large systems, so you can get to the right decision faster.

More @: www.ni.comFacebook | LinkedIn | Twitter | YouTube


POSITION OVERVIEW
Senior RF Microwave Hybrid Assembler

The NI Manufacturing team is seeking a Senior RF Microwave Hybrid Assembler, who will be responsible for multiple or all aspects of high frequency RF hybrid assembly of microcircuits.  The essential functions of the role will be:


  1. Read microcircuit dwg and specification and assemble microcircuit accordingly.

  2. Ability to epoxy die attach components as small as 10 x 10 micro-inch with gap of 2 micro-inch, or less, consistently

  3. Ability to perform bonding using ball bonder and/or wedge bonder manual tools.

  4. Experience with gap welding and/or ribbon bonding is a plus

Basic Qualifications:


  • At least 5+ years of experience in epoxy or eutectic die attach of hybrid components in high frequency microcircuits (18GHz and above)

  • At least 5+ year of experience in wire bonding – one or both, wedge-wedge bonding or ball-wedge bonding, using manual bonder.

  • Ability to work under microscope with high magnification (40x to 70x) up to 80%

Preferred Qualifications:


  • Experience with auto bonder and auto pick & place machines

  • Having R&D support and prototyping experience.