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The Hybrid MIC Process Technician will implement, document, and maintain cost-efficient, robust assembly processes to create high performance, high reliability, and consistent microwave and millimeter-wave hybrid circuit assemblies. This includes maintaining and improving existing processes and machines in the microwave and millimeter-wave hybrid circuit lab. Successful candidate will work with the Process Engineer in process development and improvement projects and ensure satisfactory training, operation, monitoring, and control.
Good hands-on knowledge of hybrid microwave integrated circuit (MIC) technology in a manufacturing environment
Good command configuring, programming, operating, qualifying, and sustaining the operation of manual and automated assembly machines (thin film, epoxy, wire bond, solder, eutectic die attach, pick-n-place, plasma cleaning, etc.)
Maintain, document and deploy the processes, methods, tools, and quality monitoring related to MIC hybrid assembly
Dynamic ability to get things done, both as an individual contributor and by collaborating with others across the organization at all levels
Life-long learner, continually striving to execute and improve in house processes.
Experience with the assembly of flip chip and microwave PCB assemblies
Experience with set up and maintaining manual and automatic bonders.
Experience with programing and maintaining automatic pick-n-place, and epoxy dispense/stamp machine
EXPERIENCE / QUALIFICATIONS
5+ years of experience of demonstrated, successful process engineering in a commercial or military hybrid microwave integrated circuit manufacturing environment
Programming control software for automated assembly machines
Using AutoCAD to view/edit 2D drawings and to review microcircuit and thin film layouts, preferred