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Auto Wirebonder at NEOTech in Chatsworth, California

Posted in Manufacturing 30+ days ago.

Type: Full-Time





Job Description:

Summary:

Operation of automatic and/or manual wire bond equipment in a clean-room environment, to manufacture high-reliability microelectronic devices.

Essential Duties and Responsibilities:


  • Read and interpret assembly instructions, drawings and work instruction processes.

  • Set up and run automatic and manual wire bond equipment

  • Ability to handle computers in order to fine tune machine programs.

  • Written tests for ESD + wirebond and ribbon bond requirements.

  • Use tools such as fine tipped tweezers, x-acto knives, vacuum pencils, dental probes, calipers, scales.

  • Knowledge of periodic machines certification for bond strengths.

  • Inspect and know the difference between an acceptable epoxy placement, die attach assembly, sub attached assembly and wire bond and ribbon bonds on a microelectronic device, in conformance with work instructions, drawings and specifications.

  • Inspect - to the drawings/specs and procedures – the devices for defects before starting the assembly and after finishing his/her part of the assembly.

  • Adhere to all ESD and other handling requirements.

  • Comply with all in-house training as identified in job specific family and or specific training plan.

  • Follow company 6S and continuous improvement (kaizen) objectives.

  • Perform all other duties, as assigned.

Job Knowledge, Skills & Abilities:


  • Perform general physical activities.

  • Monitor processes, materials and surroundings.

  • Ability to operate Plasma Cleaners, Auto wirebond, Ribbon bond and Bond Pull machines used for microelectronic devices: K&S1488, Palomar 2460, Palomar 8000, Palomar 9000 – auto wirebonders,  Palomar 2470 - auto ribbon bonder and Dage 4000, Dage 2200, Unitek MicroPull III & IV  bond pull machines or Equivalent.

  • Minimum 2 years working experience as an Auto wirebonder/Auto ribbon bonder in a microelectronic assembly factory. 

  • Familiar with MIL-PRF-38534 requirements for microelectronics’ assembly.

  • Ability to work in a class 100,000 (class 8) clean room environment using clean room antistatic gowns, facemasks, hair covers etc.  

  • Ability to work with a 30X microscope throughout the day.

  • Ability to work in manufacturing area with normal factory noise levels.

  • Ability to work on a team and be a good team member.

  • Ability to access documents using a computer

  • Should not have a problem in using chemical based cleaning systems for cleaning build substrates etc.

  • Sense of urgency, successful at meeting deadlines.

  • Mechanical aptitude/dexterity and the ability to lift up to 20 lbs

  • Fluency in English Language- Reading, written & spoken

Education/Experience:


  • High School Diploma /GED or equivalent experience

  • Valid Permanent Resident or citizen of the United States of America





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