Assembly Process Engineer ML-5169 at Cirrus Logic in Austin, Texas

Posted in Other 10 days ago.





Job Description:

At Cirrus Logic, mixed-signal engineering drives our company. We develop high-performance, low-power signal processing solutions in audio, voice and haptics, delivering innovative end-user experiences and solving difficult challenges for new generations of mobile and consumer devices. While breaking the innovation barrier, weOve also built an award-winning company culture, thanks to our extraordinary workforce and our ongoing efforts to champion and promote diversity, as well as our principles of equality and fairness in the workplace. Do you enjoy working alongside the industry's top engineers and solving sophisticated challenges for the world's top consumer brands? Join our team and help us continue to make this an exceptional place to work!

As an Assembly Process Engineer, you will work with our Package Development group to bring up an internal LFC (LGA Fan-Out Carrier) assembly lab, sustain manufacturing and drive yield improvement at the OSATs (outsourced assembly and test)!

Responsibilities


  • Bring up process and equipment for an internal LFC (LGA Fan-Out Carrier) assembly lab to enable reliability stressing of devices.

  • Define Best Known Methods (BKM) for each assembly process and drive process standardization efforts. Deployment of BKM to OSATs.

  • Work with OSATs and manufacturing partners to sustain production processes and drive yield enhancement

  • Evaluate OSAT process change requests and define evaluation and implementation plans to minimize risk on high volume manufacturing production.

  • Support troubleshooting at OSAT and customer Contract Manufacturer.

Required Skills and Qualifications


  • BS MS degree in Mechanical Engineering or Materials Science. Minimum cumulative 3.0 GPA

  • 3 or more years meaningful experience in WLCSP or wafer fab processing.

  • Intimate knowledge of WLCSP processing and materials required. This includes back grinding, laser grooving, wafer mechanical sawing, wafer backside coating, WLCSP bumping (including photolithography, plasma, sputtering, RDL/UBM plating, etching, and ball drop), Automatic Optical Inspection (including laser mark and pick and place).

  • Familiar with manufacturing tools (FMEA, SPC, JMP)


Preferred Skills and Qualifications


  • Knowledge of semiconductor devices and electronics applications Demonstrated analytical and problem solving skills

  • Demonstrated ability to manage multiple challenges and large data sets effectively

  • Strong written and verbal communication skills. Ability to communicate technical ideas with customer and high-level management.

  • Ability to work in teams and collaborate effectively with people in different functions

  • Ability to build strong, influential relationships

  • Ability to work effectively in a fast-paced and rapidly changing environment

  • Ability to take the initiative and drive for results

This position is located in Austin, TX

Cirrus Logic is an Equal Opportunity/Affirmative Action Employer. We strive to select the best qualified applicant for any opening and to reward employees based on their skills, experience and performance. We do not discriminate on the basis of race, color, national origin, pregnancy status, marital status, gender, age, religion, physical or mental disability, medical condition, veteran status, sexual orientation, gender identity, genetic information or any other characteristic protected by law.