REPORTS TO: MANAGER, DRY ETCH MANUFACTURING ENGINEERING
SUMMARY:
Under the direction of the Manager of Dry Etch Manufacturing Engineering, the Dry Etch Manufacturing Engineer is responsible for the maintaining and optimizing dry etch processes (RIE, IBE, Ashing, etc.) for existing products, developing and implementing new processes for future magnetic heads and Si-based device products. Additional responsibilities include using SPC (Statistical Process Control), designing and conducting wafer experiments, analyzing the data, and reporting the results; developing and implementing practices or methodologies which reduce cost and improve operational efficiency; conducting root cause analysis and implementing corrective action; developing and implementing procedures for production line to follow; and reviewing, updating, and maintaining documentation and process instructions. This position is located in Milpitas, California.
ESSENTIAL FUNCTIONS:
Maintains and optimizes dry etch processes for existing products; develops and implements new processes for future magnetic heads and Si-based device products
Reviews characterization data from FIB, SEM, and TEM to conduct root cause analysis and recommend corrective action
Implements new process control schemes or methodologies which ensure product manufacturability
Develops and implements practices or methodologies which reduce cost and improve operational efficiency
Reviews, updates, and maintains documentation and process instructions
Interacts with suppliers and vendors to ensure that appropriate materials or supplies are readily available for line use
Instructs operators and technicians on processes and procedures, including modifications to existing procedures
Partners with equipment and maintenance personnel in order to minimize tool down time and integrate new tools into the production line
Designs and conducts experiments, analyzes data, and develops recommendations for improving the performance or reducing cost based on test results
Partners with other groups and departments, including process and product engineering to develop and implement new processes which reduce scrap and improve yield
Responds to inquiries from other team members, managers, or departments
Adheres to all safety policies and procedures as required
MINIMUM QUALIFICATIONS:
Bachelor's degree in Materials Science, Physics, or Electrical Engineering and/or equivalent relevant experience; Master's degree preferred
Three years of experience working in the magnetic recording head, hard disk drive, or semiconductor industry as a Process Engineer
Experience in plasma etch process development (RIE, IBE, Ashing, etc.) is preferred
Experience working in a wafer fab manufacturing environment
Experience with Statistical Process Control (SPC)
Proficient in the use of Microsoft Office Applications
Knowledge, Skills, and Abilities:
Knowledge of semiconductor or HDD industry principles, practices, and techniques
Knowledge of wafer fabrication processing techniques, including process development and integration practices
Knowledge of plasma etch (RIE, IBE, ashing, etc.) principles, practices, and techniques
Knowledge of TEM, SEM, and FIB and ability to analyze data from these sources to determine root cause of failure
Knowledge and ability to use Excel, JMP, or other software applications such as VBA to analyze data, create reports, present findings, and recommend appropriate action
Knowledge and ability to use Microsoft Office applications to create reports and presentations
Able to communicate effectively, both verbally and in writing, with all levels of contractors, consultants, employees, and management
Able to work productively and collaboratively with all levels of employees and management
Able to comply with all safety policies and procedures
Demonstrated organizational and time management skills
Demonstrated problem-solving and trouble shooting skills
Flexible and able to prioritize
The annual base salary for this full-time position is between $96,655.20-$142,140.00 + bonus target + benefits. Within the range the individual pay may differ depending on additional factors including job responsibilities, job related knowledge, skills, abilities, education, and experience. The annual base pay range shown is subject to change and may be modified periodically.
WORKING CONDITIONS:
The Dry Etch Manufacturing Engineer works primarily in an office environment from Monday thru Friday. The schedule may be altered from time-to-time to meet business or operational needs; may travel from building-to-building as needed. May also work in a class 100 ESD sensitive wafer fab manufacturing facility; adheres to required safety and dress standards. May be exposed to hazardous chemicals, fumes, or vapors and excessive noise from time-to-time while in the wafer manufacturing facility; stands and walks; performs various fine grasping movements, bends, and twists; operates a computer and enters information using a keyboard, operates a telephone, and other office equipment. May occasionally be required to push, pull, or lift up to 10 pounds.
Other duties of a similar nature or level are duties that may be required, but may not be specifically listed in the job description or posting.
TDK/Headway Technologies, Inc. provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, religion, gender, national origin, age, disability, or genetics. Applicants requiring accommodation in order to complete the application process should contact the Headway Human Resources Department.