*Manage, design and develop surface mount and through hole electronic assembly processes and technologies and related inspection processes.
*Experience with rheology/rheometry (strain/stress/shear, etc.).
*Reflow and solder paste chemistries.
*Experience in electronics/electrical engineering.
*Automated placement equipment.
*Knowledge of quality metrics (e.g. DPMO and use of statistics.
*Working with cross-functional teams, you will support existing processes and help create new processes to achieve company goals.
*Using your problem-solving expertise, you will actively help drive and improve company metrics:
*Safety performance by contributing to job hazard assessment.
*Quality performance through COPQ improvements in FPY, scrap and warranty returns.
*Delivery and Cost performance through:
*Quality improvements noted above
*Increased production capability
*Reduction of cycle times
*Reduction of WIP
*Improvement of OEE and equipment MTBF metrics.
*You will work closely with Design Engineering and New Product Launch teams to apply lessons learned to new products.
*You will be responsible for creation and maintenance of process documentation such as: work instructions, PFMEA, Control plans, PFLOWS, equipment PMs.
*You will be responsible for using and applying lean tools such as: VSM, work measurement, SMED, TPM, and 5S to achieve company objectives.
*You will be responsible for new capital projects from identification of need through justification, acquisition, implementation, and validation.
*You will work with internal and external suppliers to develop fixtures and tooling.
*You will be responsible for improving and monitoring operational costs for production equipment by leading actions to optimize OEE.
*Support TPM practices by training and mentoring peers, technicians, and operators.
*Self-manage professional development by identifying and setting up training with equipment suppliers and automation integrators.