RF-mmWave Packaging Engineer at L&T Technology Services in Sunnyvale, California

Posted in Other 15 days ago.

Type: full-time





Job Description:

Responsibilities:
  • Design, simulate and validate advanced RF/mmWave packaging/module solutions. Liaise with OSAT vendors for manufacturing.
  • Design, simulate and validate Integrated passive device (IPD). Liaise with foundry for Tapeout.
  • Design PCB schematic, layout and perform circuit and 3D EM simulation.
  • RF lab debug, tuning, performance optimization and validation.

Minimum Qualification:
  • 3+ years of experience in developing RF/mmWave packages and IPD design.
  • At least BSEE or BSc in related engineering discipline
  • In depth knowledge in electromagnetics, RF filters, PA and LNA design.
  • Experience with foundry Tapeout and working with OSAT vendors.
  • Experience in RF schematics, layouts, and DFM.
  • Experience with RF lab equipment and probe station for device characterization, debug, and component/system performance validation.
  • Experience using circuit, EM, and thermal simulation tools such as Ansys HFSS, Keysight ADS/Momentum, Cadence Allegro, Cadence Virtuoso, Ansys Icepak, Flotherm.
  • Good communicator and team player.

Preferred Qualification:
  • MS or PhD in EE with emphasis on advanced packaging or RFIC/mmWave design
  • 5+ years of relevant industry experience
  • Familiar with RF system design.
  • Familiar with regulatory requirements (FCC, CE, etc.).

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