Defect Reduction Yield Engineer at MACOM in Lowell, Massachusetts

Posted in Other 30+ days ago.





Job Description:

MACOM designs and manufactures semiconductor products for Data Center, Telecommunication and Industrial and Defense applications. Headquartered in Lowell, Massachusetts, MACOM has design centers and sales offices throughout North America, Europe and Asia. MACOM is certified to the ISO9001 international quality standard and ISO14001 environmental management standard.

MACOM has more than 65 years of application expertise with multiple design centers, Si, GaAs and InP fabrication, manufacturing, assembly and test, and operational facilities throughout North America, Europe, and Asia. Click here to view our facilities. In addition, MACOM offers foundry services that represents a key core competency within our business.

MACOM sells and distributes products globally via a sales channel comprised of a direct field sales force, authorized sales representatives and leading industry distributors. Our sales team is trained across all of our products to give our customers insights into our entire portfolio.

MACOM is an Equal Opportunity Employer

We consider applicants for all positions without regard to race, color, religion, creed, gender, national origin, age, disability, marital status or veteran status or any other legally protected status.

Defect Reduction Yield Engineer

Job Description:

In this critical role you will be responsible for driving yield improvement through wafer level defect reduction within MACOM's internal semiconductor fab. The product portfolio includes GaN/SiC, GaAs, Si, and InP based technologies. Responsibilities include investigating root cause of process defects and driving corrective actions, creating and maintaining a defect reduction roadmap to meet business requirements, and characterizing process defects for yield improvement. This will be done in close partnership with Process Engineers, Device and Integration Engineers, Design Engineers, and the Fab production team. A strong knowledge of semiconductor processing, exceptional communication skills, excellent judgement, and an optimistic, can-do approach are essential to success in this role. The position reports to the Director of Engineering.

Job Qualifications:


  • BS or MS degree Electrical Engineering, Chemical Engineering, Mechanical Engineering, Materials Science, Physics, Chemistry, or equivalent with 5 years of fab experience

  • Demonstrated knowledge of defect metrology inspection tools including microscopes, AOI, and SEM.

  • Demonstrated knowledge in compound semiconductor processes.

  • Strong understanding of semiconductor device physics and IC processing, data mining and statistics, SPC, DOE, Lean manufacturing, Six Sigma, and structured problem solving.

  • Must have a proven track record of solving technical problems, project ownership, meeting deadlines, and multitasking.

  • Must display a strong sense of ownership, drive, and dedication to continuous improvement.

  • Must display an enthusiastic boldness for taking on aggressive goals and a commitment to achieving them.

  • Must possess the ability to work collaboratively with cross functional teamsto improve processes.

  • Excellent verbal/written communication skills, including technical writing for summarizing data and findings, writing process and equipment specifications and work instructions.

  • Detail-oriented with strong organizational skills.

  • Due to ITAR restrictions, must be US citizen or Permanent Resident.

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